Automated Diamond Scribe and Break Production System

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Semiconductor > Equipment for Semiconductor Production > Scribe and Break System

Description

The DTX Scribe and Break performs high precision diamond scribe and break dry dicing for materials such as Indium Phosphide, Gallium Arsenide, Gallium Nitride, Silicon, and Borosilicate Glass, in substrate sizes up to 200 mm.

High precision production and R&D tool
Integrated vision system provides simple automatic processing operations
User friendly GUI with touch screen operation for ease of operator interface
Wizard guided system calibrations
Windows 10 based software
Single adjustable monitor
Integrated scribe and break stages
Multiple break types/assemblies available
200 mm wafer and partial wafer processing
Fully automatic and manual modes


<Specification>
Wafer Size: Up to 200 mm
Base Plate Material: Granite
X Y Theta Actuators: Linear motors
X Y Stage Resolution: 0.2 microns
1 micron minimum step (accuracy)
Theta Stage Resolution: 0.001 degree
Positioning System Feedback Mechanism: Optical encoder
Axis Controllers: Dedicated controller per axis
Stability: Vibration free mounts
Controller Communication Distribution: RJ45 LAN - 100 MB/s Ethernet
Allows for fastest MTTR, remote support/service and diagnostics, and process assistance
Operator Interface: Single touch screen monitor for fast and easy operation
Enclosure: Corrosion resistant steel
Internal Access: Lift off covers
Safety: Mechanically operated interlock switches
Footprint: 1.8 m2
PM Schedule: 6 months